Are you looking to buy Thermaltake TOUGHRAM XG RGB 32GB (2x16GB) DDR5 6200MT/s C32 Memory (Intel XMP 3.0 / AMD EXPO Ready) [PC] in Australia?
· Sleek and Sophisticated Design |
· Tightly-Screened ICs |
· Capacity Doubled for Better Efficiency |
· More Energy Savings |
· Long-term Stability |
Built with high-quality components, the TOUGHRAM XG RGB D5 features a unique design and 16 LEDs for a more dynamic lighting experience, providing high gaming performance with vivid RGB colours.
Sleek and Sophisticated Design
Designed with 2 different colours of aluminium and trimmed with a chrome stripe in the middle, the TOUGHRAM XG RGB D5 provides a fresher look and is in its class of its own.
Tightly-Screened ICs
Memory chips are thoroughly-screened to provide optimal frequency and response time performance.
Capacity Doubled for Better Efficiency
With a doubled bank group architecture, the TOUGHRAM XG RGB D5 Memory DDR5 enhances access availability and brings you higher capacities without lag, leading the way to next-gen memory.
More Energy Savings
The new DDR5 memory features a built-in Power Management IC (PMIC) to enhance power supply stability with just 1.1V low operating voltage, resulting in optimized power-efficiency compared to DDR4.
Long-term Stability
On-die error correction code (ECC) allows memory modules to correct errors automatically which brings increased stability and reliability.
MADE FOR GAMING
Immersive yourself in all around RGB world and turn it to your own gaming vibe.
MADE FOR SPEED
Overclock with ease to achieve optimal frequency and accelerate your workflow.
MADE FOR AESTHETICS
Add extra flair to create unique builds with 16 LEDs.
2oz Copper PCB
Specially optimized 10-layer PCB with 2oz copper inner layer provides enhanced electrical conduction to deliver uncompromised speed and reliability for maximum overclocking performance.
High Quality Gold Fingers
Use of 10μ gold fingers for enhanced durability and high wear resistance.
Aluminium Heat Spreader
Use of aluminium heat spreader delivers exceptional heat dissipation to meet high-performance needs.